LG Electronics made its debut at Data Center World Asia 2026 in Singapore, unveiling a Hydronic Modular system that preassembles pumps, valves, emergency buffer tanks, and piping inside ISO-specification containers to reduce on-site installation work and allow cooling capacity to be added in phases as server deployments grow. The company also introduced 1MW and 2.6MW coolant distribution units for direct-to-chip liquid cooling of GPUs and CPUs, expanding a lineup that began with a 600kW model and has received quality standard approval from Nvidia. Additional products on display included an air-cooled oil-free inverter turbo chiller using magnetic bearings, a fan wall unit for dense server rooms, and immersion cooling technology. LG Electronics said it plans to combine its HVAC capabilities with LG Energy Solution's battery products and LG CNS's data center design and operations services to address AI data center design, construction, and expansion.
The Hydronic Modular system addresses a practical construction bottleneck by moving chilled-water distribution assembly from the job site to a factory, which can shorten build timelines for operators facing urgent AI infrastructure deployment schedules. The expansion to 2.6MW CDUs and Nvidia-certified liquid cooling products positions LG Electronics to compete directly with established cooling vendors as rack densities approach 1MW, a threshold Garvens at Google also cited as imminent.
LG Electronics entering the modular data center cooling market for AI workloads in Asia represents a significant new competitive entrant from a major global electronics brand. The named company and regional market focus make this distinct from generic cooling product announcements.