Veir builds superconducting power-delivery systems designed to move large amounts of electricity through a smaller physical footprint than conventional copper-based infrastructure. Its systems combine superconducting cables with cryogenic cooling, controls, termination units and monitoring equipment, and are aimed at distributing power within AI data-center facilities. Founded in 2019 and based in Woburn, Massachusetts, the company has demonstrated a 3-megawatt superconducting power-delivery system and is preparing for initial commercial deployments.
Led by Matter Venture Partners and Tyche Partners, with participation from LG Technology Ventures, Gates Frontier, Sabanci Climate Ventures, Hui Capital, Engine Ventures, Galvanize Climate Solutions, Piva Capital, Congruent Ventures, and VXI Capital.
The raise brings Veir's total capital to $225 million and marks a shift from technology demonstration to commercial-scale manufacturing, a milestone that signals investor conviction that superconducting power delivery can compete with conventional copper systems inside AI campuses. As data-center operators pack more computing density into limited physical space, the ability to deliver more power through a smaller footprint addresses a specific infrastructure bottleneck that standard electrical systems struggle to solve. The oversubscribed round, drawing a broad mix of climate-focused and technology-focused investors, reflects growing capital interest in the power-delivery layer of AI infrastructure, not just the compute layer.